Research Catalog

Details

Additional authors

1. Iturralde, Armando.
2. Lin, Te-Hua.
3. Society of Photo-optical Instrumentation Engineers.
4. Semiconductor Equipment and Materials International.

Description

1. vii, 258 pages : illustrations; 28 cm.

Series statement

1. Proceedings / SPIE--the International Society for Optical Engineering ; v. 2876

Uniform title

1. Proceedings of SPIE--the International Society for Optical Engineering ; v. 2876.

Subject

1. Plasma etching > Congresses
2. Metallizing > Congresses
3. Dielectric films > Congresses
4. Integrated circuits > Design and construction > Congresses

Contents

1. Productivity improvement through industrial engineering in the semiconductor industry / D. Meyersdorf -- Advanced process control system for vertical furnaces / R. Berger, C. Schneider, W. Lehnert, L. Pfitzner and H. Ryssel -- Yield effects of interactions between high polymer forming metal etch processes and postetch ash processes / T.-Y. Yong and J. Wang -- Data-driven method for calculating limits for particle control charts / D. Michelson -- Tracing metal defect relating to yield for VLSI manufacturing / Y.-C. Loe, C.-H. Lee, C.-C. Lin, C.-M. Yang, C.-C. Lin, K. L. Lu and J. J. Yang -- Productivity improvement through cycle time analysis / J. Bonal, L. Rios, C. Ortega, S. Aparicio, M. Fernandez, M. Rosendo, A. Sanchez and S. Malvar -- Characterization and in-line control of UV-transparent silicon nitride films for passivation of FLASH devices / J.-Z. Zheng, D. Tan, P. Chew and L. Chan --
2. Photolithography equipment control through D-optimal design / A. B. Charles, Y. Chandon, F. Bergeret and L. Garcia -- Dynamics of recrystallization and melting of implanted silicon at irradiation by powerful light pulses / Y. V. Fattakhov, M. Galyautdinov, T. N. L'vova and I. B. Khaibullin -- Micromachined sensor for in-situ monitoring of wafer state in plasma etching / M. D. Baker, O. Brand, M. G. Allen and G. S. May -- Defect reduction through characterization and equipment modification in tungsten residue caused by deposition process / H.-T. Lin, S.-C. Lee and H.-W. Chang -- Systems engineering approach to maintainability optimization with case studies on ion implanters and sputtering tools / E. Girolami and M. Mazzer -- Optimizing process and equipment efficiency using integrated methods / M. J. D'Elia and T. F. Alfonso -- In-line electrical probe for CD metrology / E. E. Chain and M. D. Griswold --
3. Platinum-related deep levels in silicon and their passivation by atomic hydrogen using a home-built automated DLTS system / B. P. N. Reddy, P. N. Reddy and S. V. Pandu Rangaiah -- Process monitoring using surface charge profiling (SCP) method / J. Ruzyllo, P. Roman, J. Staffa, I. Kashkoush and E. Kamieniecki -- Noncontact sheet resistance measurements for doped polysilicon process control / W. H. Johnson, L. Nguyen, B. Schanzer, T. Campbell and J. White -- Nondestructive testing of semiconductors and thin coatings / Yu. N. Pchelnikov and A. A. Yelizarov -- Piecewise nonlinear regression: a statistical look at lamp performance / G. D. Halverson and M. G. Hamilton -- Control chart design strategies for skewed data / S. T. Mandraccia, G. D. Halverson and Y.-M. Chou -- Improving within-run uniformity of polysilicon film / J. Barker -- SPC qualification strategy for CD metrology / E. E. Chain, M. G. Ridens and J. P. Annand --
4. Practical automatic feedback system for polyphoto CD control / J. H. Chen and C. Y. Wang -- Particle reduction study at interlayer dielectric deposition / A. McAfee, M. Jacobs and R. Hiatt -- Increased process stability for CVD tungsten via in-situ particle monitoring and upstream process control / K. Huber, T. DeSanti and S. Felker -- Submicron calibration strategy for CD control / E. E. Chain, L. Kulkens and T. A. Harris.

Owning institution

1. Columbia University Libraries

Bibliography (note)

1. Includes bibliographic references and author index.