Research Catalog

Process and materials characterization and diagnostics in IC manufacturing : 27-28 February 2003, Santa Clara, California, USA / Kenneth W. Tobin, Jr., Iraj Emami, chairs/editors ; sponsored ... by SPIE--the International Society for Optical Engineering.

Title
  1. Process and materials characterization and diagnostics in IC manufacturing : 27-28 February 2003, Santa Clara, California, USA / Kenneth W. Tobin, Jr., Iraj Emami, chairs/editors ; sponsored ... by SPIE--the International Society for Optical Engineering.
Published by
  1. Bellingham, Wash., USA : SPIE, [2003], ©2003.

Items in the library and off-site

Filter by

Displaying 1 item

StatusFormatAccessCall numberItem location
Status
Request for on-site useRequest scan
How do I pick up this item and when will it be ready?
FormatTextAccessRequest in advanceCall numberTK7874 .P745 2003gItem locationOff-site

Details

Additional authors
  1. Emami, Iraj.
  2. Society of Photo-optical Instrumentation Engineers. http://id.loc.gov/authorities/names/n78088934
  3. Tobin, Kenneth W.
Description
  1. x, 222 pages : illustrations (some color); 28 cm.
Series statement
  1. SPIE proceedings series, 0277-786X ; v. 5041
Uniform title
  1. Proceedings of SPIE--the International Society for Optical Engineering ; v. 5041.
Alternative title
  1. Design, process integration, and characterization for microelectronics.
Subject
  1. Integrated circuits > Analysis > Congresses
  2. Integrated circuits > Design and construction > Congresses
  3. Integrated circuits industry > Quality control > Congresses
  4. Quality control > Congresses
  5. Semiconductor wafers > Analysis > Congresses
  6. Semiconductors > Design and construction > Congresses
Contents
  1. Neural-network-based time series modeling of optical emission spectroscopy data for fault detection in reactive ion etching / S. J. Hong and G. S. May -- Spectroscopic ellipsometric scatterometry: sources of errors in critical dimension control / J. Hazart, G. Grand, P. Thony, D. Herisson, S. Garcia and O. Lartigue -- Copy result exactly using EB-Scope technology / K. Yamada, T. Ushiki, Y. Itagaki and R. Newcomb -- Defect distribution model validation and effective process control / L. Zhong -- COPs/particles discrimination using an automated surface inspection tool / G. Lorenzi, K. H. Nguyen, C. Sanna, R. Orizio and G. Borionetti -- In-line e-beam inspection with optimized sampling and newly developed ADC / M. Ikota, A. Miura, M. Fukunishi, T. Hiroi and A. Sugimoto -- Characterization and reduction of copper chemical-mechanical-polishing-induced scratches / T. Y. Teo, W. L. Goh, L. S. Leong, V. S. K. Lim, T. Y. Tse and L. Chan -- Successful demonstration of a comprehensive lithography defect monitoring strategy / I. B. Peterson, L. H. Breaux, A. Cross and M. von den Hoff -- Intentional defect array wafers: their practical use in semiconductor control and monitoring systems / I. Emami, M. McIntyre and M. Retersdorf -- Advanced ASIC defect control / C. May, J. Knoch and R. Y. B. Young -- Novel technique for contamination analysis around the edge, the bevel, and the edge exclusion area of 200- and 300-mm silicon wafers / C. M. Sparks, C. F. H. Gondran, P. S. Lysaght and J. T. Donahue -- Depth profile characterization of hydrogen-implanted silicon using spectroscopic ellipsometry / T. Gubiotti, D. Jacy and R. J. Hoobler -- Sidewall structure estimation from CD-SEM for lithographic process control / P. R. Bingham, J. R. Price, K. W. Tobin, Jr., T. P. Karnowski, M. H. Bennett, E. H. Bogardus and M. Bishop -- CD-SEM measurement line-edge roughness test patterns for 193-nm lithography / B. D. Bunday, M. Bishop, J. S. Villarrubia and A. E. Vladar -- Location of interconnect defects using focused ion beam (FIB)-induced voltage contrast and subsequent in-situ FIB cross-sectioning and auger electron analysis in the Physical Electronics 200/300-mm SMART-tool / C. F. H. Gondran, D. F. Paul, K. D. Childs, L. G. Dennig and G. C. Smith -- X-ray reflectivity: a new metrology alternative for DUV ARCs / D. Agnihotri, D. Calhoun, J. Formica, J. Harmon and L. Nevala -- LithoCell-integrated critical dimension metrology / J. B. Stirton, C. W. Miller, A. Viswanathan, M. Miyagi, L. Lane, M. A. Laughery, T. Parikh, K. C. Chan and A. Sezginer -- Complete monitoring strategy to quantify matching and performance for multiple CDSEM in advanced fab / P.-Y. Lee, C.-S. Lo, Y.-H. Chen, T. Teng, S. Fu, M. Chu and J. C. Yee -- Industry survey on nonvisual defect detection / C. A. Boye -- Semiconductor wafer defect detection using digital holography / M. A. Schulze, M. A. Hunt, E. Voelkl, J. D. Hickson, W. R. Usry, R. G. Smith, R. Bryant and C. E. Thomas, Jr. -- Nanovision: a new paradigm for enabling fast optical inspection of nanoscale structures / M. E. Watts and R. E. Diaz -- In-line measurement characterization for multilayer film stack of SiGe by advance spectroscopy ellipsometer / J. C. Chen, A. Srivatsa, C. C. Chien and T. E. Liu -- Development of an electron optical system using EB projection optics in reflection mode for EB inspection / Y. Yamazaki, I. Nagahama and A. Onishi.
Note
  1. Earlier conference called: Design, process integration, and characterization for microelectronics.
Bibliography (note)
  1. Includes bibliographical references and index.