Research Catalog

Details

Additional authors

1. IEEE Components, Hybrids, and Manufacturing Technology Society.

Description

1. xvi, 291 pages : illustrations; 28 cm

Alternative title

1. 1997 IEEE 13th Annual Semiconductor Thermal Measurement & Management Symposium
2. Semiconductor Thermal Measurement and Management Symposium, 1997, SEMI-THERM XIII, Thirteenth Annual IEEE.

Subject

1. Semiconductors > Thermal properties > Congresses
2. Semiconductors > Cooling > Congresses
3. Semiconductors > Cooling
4. Semiconductors > Thermal properties
5. Semiconducteurs > Propriétés thermiques > Congrès
6. Systèmes électroniques > Propriétés thermiques > Congrès

Genre/Form

1. Conference papers and proceedings.

Contents

1. Welcome to Semi-Therm XIII -- Overview of Components, Packaging, & Manufacturing Technology Society of the IEEE -- Short Course -- Experimental Methods in Air Cooling of Electronics / Robert J. Moffatt and Alfonso Ortega -- Thermal Sub-Modeling of the Wirebonded Plastic Ball Grid Array Package / Zane Johnson, Koneru Ramakrishna and Bennett Joiner [and others] -- Issues in Validating Package Compact Thermal Models For Natural Convection Cooled Electronic Systems / V.H. Adams, Y. Joshi and D.L. Blackburn [and others] -- Evaluation of Isothermal and Isoflux Natural Convection Coefficient Correlations for Utilization in Electronic Package Level Thermal Analysis / Bret A. Zahn and Roger Paul Stout -- Recent Achievements in the Thermal Characterization of Electronic Devices By Means of Boundary Condition Independent Compact Models / H. Vinke and C.J.M. Lasance -- Thermal Characterization of Electronic Parts with Compact Models: Interpretation, Application and the Need for a Paradigm Shift / Clemens J.M. Lasance -- High Power Multichip Modules Employing the Planar Embedding Technique and Microchannel Water Heat Sinks / R. Hahn, A. Kamp and A. Ginolas [and others] -- Thermal Modeling of Grease-Type Interface Material in PPGA Application / Chia-Pin Chiu, Gary Solbrekken and Yoke D. Chung -- Hinged Heat Pipes for Cooling Notebook PCs / Masataka Mochizuki, Yuji Saito and Kazuhiko Goto [and others] -- Final Report to SEMITHERM XIII on the European-Funded Project DELPHI -- The Development of Libraries and Physical Models for an Integrated Design Environment / H.I. Rosten, J.D. Parry and C.J.M. Lasance [and others] -- Multiobjective Optimization of Component Placement on Planar Printed Wiring Boards / Nestor V. Queipo and Guy F. Gil -- Thermally Constrained Placement of Smart-Power IC's and Multi-Chip Modules / K. Lampaert, G. Gielen and W. Sansen -- Thermal Analysis of a Chip On Board (COB) / J. De Moerloose and W. Temmerman -- Organic PGA Packaging -- A Performance Comparison with Ceramic PGA / Ram Viswanath and Chia-Pin Chiu -- Advanced Cooling Techniques Comparison for Airborne Electronic Circuits / Yannick Assouad, Michel Caplot and Thierry Gautier -- Surface Mount Technology Heat Sinks For D[superscript 2]PAK and D[superscript 3]PAK Power Semiconductors / E.G. Flynn, C.N. Johnston and S. Lee -- An Experimental Study of Forced Convection Heat Transfer From In-Line Pin Fin Arrays / Vinod K. Maudgal and J.E. Sunderland -- Characterization of Longitudinal Fin Heat Sink Thermal Performance and Flow Bypass Effects Through CFD Methods / Adam V. Barrett and Izundu F. Obinelo -- Compact Air-Cooled Heat Sinks for Power Packages / A. Aranyosi, L. Bolle and H. Buyse -- Thermal Characterization of Chip Packages -- Evolutionary Development of Compact Models / Avram Bar-Cohen and William B. Kkrueger -- Comparison of Diodes and Resistors for Measuring Chip Temperature During Thermal Characterization of Electronic Packages Using Thermal Test Chips / Alan Claassen and H. Shaukatullah -- Thermal Testing Methods to Increase System Reliability / V. Szekely, M. Rencz and B. Courtois -- Transient Thermal Study of Laser Diodes / Chin C. Lee, Jae W. Lee and David H. Chien [and others] -- Pressure Drop and Heat Transfer in an Isothermal Channel with Impinging Flow / Catharina R. Biber -- Design of Circular Heat Spreaders on Semi-Infinite Heat Sinks in Microelectronics Device Applications / P. Hui, H.S. Tan and Y.S. Lye -- Pressure Loss Modeling for Surface Mounted, Cuboid-Shaped Packages in Channel Flow / P. Teertstra, M.M. Yovanovich and J.R. Culham -- Thermal Management in PowerPC Microprocessor Multichip Modules Applications / Tsorng-Dih Yuan -- Past Proceedings and Other Publications.

Owning institution

1. Princeton University Library

Note

1. "The Components, Packaging, & Manufacturing Technology (CPMT) Society, Symposium sponsor."

Bibliography (note)

1. Includes bibliographical references.