Research Catalog

Stress induced phenomena in metallization : fifth international workshop, Stuttgart, Germany, June, 1999

Title
  1. Stress induced phenomena in metallization : fifth international workshop, Stuttgart, Germany, June, 1999 / editors, Oliver Kraft [and others].
Published by
  1. Melville, N.Y. : American Institute of Physics, ©1999.

Items in the library and off-site

Filter by

Displaying 1 item

StatusFormatAccessCall numberItem location
Status
Request for on-site useRequest scan
How do I pick up this item and when will it be ready?
FormatTextAccessUse in libraryCall numberTK7871.85 .S769 1999Item locationOff-site

Details

Additional authors
  1. Kraft, Oliver.
  2. International Workshop on Stress-Induced Phenomena in Metallization (5th : 1999 : Stuttgart, Germany)
Description
  1. ix, 318 pages : illustrations; 25 cm
Series statement
  1. AIP conference proceedings, 1551-7616 ; no. 491
Uniform title
  1. AIP conference proceedings ; no. 491.
Subject
  1. Integrated circuits > Defects > Congresses
  2. Thin film devices > Defects > Congresses
  3. Electrodiffusion > Congresses
  4. Metallic films > Congresses
  5. Electrochemical metallizing > Congresses
  6. Aluminum films > Congresses
  7. Semiconductors > Defects > Congresses
  8. Liquid crystal devices > Defects > Congresses
  9. Acoustic surface wave devices > Defects > Congresses
  10. Thermal stresses > Congresses
  11. Strains and stresses > Congresses
  12. Thermal stresses
  13. Strains and stresses
  14. Aluminum films
  15. Electrochemical metallizing
  16. Electrodiffusion
  17. Integrated circuits > Defects
  18. Metallic films
  19. Semiconductors > Defects
  20. Thin film devices > Defects
  21. Fisica geral
  22. Metallic films > Electric properties > Congresses
  23. Thin film devices > Congresses
  24. Liquid crystal devices > Congresses
  25. Aluminum films > Electric properties > Congresses
  26. Acoustic surface wave devices > Congresses
  27. Metallizing > Congresses
  28. Semiconducteurs > Couches minces > Congrès
  29. Microélectronique > Congrès
Genre/Form
  1. Conference papers and proceedings
Contents
  1. Reliability of interconnects -- Fundamentals of electromigration.
  2. Reliability of interconnects -- Fundamentals of electromigration -- Microstructure and thermal stresses.
Owning institution
  1. Princeton University Library
Note
  1. "The International Workshop on Stress Induced Phenomena in Metallization"--Pref.
Bibliography (note)
  1. Includes bibliographical references and indexes.
Additional formats (note)
  1. Also available in an electronic version.