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Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas / sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronics Packaging Division, ASME ; edited by William T. Chen, David T. Read.

Text

New York, N.Y. : American Society of Mechanical Engineers, [1997], ©1997.

1997-1997

1 item

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FormatTextCall numberTK7870.15 .A67 1997gItem locationOff-site
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Proceedings of the ASME Heat Transfer Division : presented at the 1997 International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas / sponsored by the Heat Transfer Division, ASME.

Text

New York, N.Y. : American Society of Mechanical Engineers, [1997], ©1997.

1997-1997

3 items

FormatCall numberItem location
FormatTextCall numberTJ260 .P7646 1997g v.1Item locationOff-site
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FormatTextCall numberTJ260 .P7646 1997g v.2Item locationOff-site
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FormatTextCall numberTJ260 .P7646 1997g v.3Item locationOff-site

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